Paras Defence and Space Technologies Limited announced on January 19, 2026, that its Board of Directors has approved the incorporation of a new subsidiary named “Paras Semiconductors Private Limited” (or a similar name approved by the Ministry of Corporate Affairs).

This new entity will focus on setting up State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing). The subsidiary's key areas of focus will be AI, High-Performance Computing (HPC), Networking, and Data Center Applications.

The proposed subsidiary will have an authorized and paid-up share capital of ₹10,00,000 (Rupees Ten Lakhs) each, divided into 1,00,000 equity shares of ₹10 each. Paras Defence will initially subscribe to 70,000 equity shares, aggregating to ₹7,00,000 (Rupees Seven Lakhs), acquiring a 70% stake in the proposed subsidiary. The investment will be made in cash and is considered an arm's length transaction, not falling under related party transactions for the parent company prior to investment, though the subsidiary will become a related party post-investment.