Moschip Technologies announced the successful silicon bring-up of a custom SoC for ISRO's Space Applications Centre (SAC) on a 28nm technology node. This marks the completion of an end-to-end turnkey ASIC program, from Netlist to packaged silicon delivery.

The company managed all critical phases, including DFT architecture, implementation, and verification, full-chip physical design and sign-off, RDL design and routing, package design, tester board design, and post-silicon bring-up and validation. Moschip also handled substrate design for a 10 Layer FC-CBGA package and assembly, validating engineering samples on ATE.

Srinivasa Rao Kakumanu, CEO & MD of Moschip Technologies, stated, "We are proud to have delivered this critical program. This milestone validates Moschip’s turnkey Netlist-to-Silicon capability and our commitment to single-owner accountability from design intent to validated silicon." The delivered packaged silicon enables SAC to proceed to the next stage of production for India's Satellite Navigation Program.