IZMO Limited announced that its division, izmo Microsystems, has successfully designed a high-complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This advanced module utilizes stacked substrates to meet space-grade reliability standards. By re-engineering traditional 200 mm × 200 mm PCB-based electronics into a compact 81 mm × 81 mm SiP module, izmo Microsystems has achieved an 84% reduction in footprint. This was accomplished through the integration of active components in bare-die form onto a stacked-substrate configuration using high-density wire bonding, allowing for high routing density and multi-function integration within compact dimensions.

The module is enclosed in a fully indigenized custom Hermetic Ceramic Package, designed and fabricated in India. This hermetic solution is engineered for environmental robustness and long-term performance in extreme space conditions, addressing challenges in signal integrity and thermal dissipation within a small volume.

This achievement is a significant advancement for India's semiconductor mission and the 'Make in India' initiative, positioning izmo Microsystems among a select group of global Tier-1 aerospace firms. By developing 3D vertical stacking and hermetically sealed ceramic packages indigenously, the company reduces reliance on restricted foreign technologies for mission-critical applications, establishing a sovereign technical foundation for Silicon Photonics and Quantum Communications.

Dinanath Soni, Executive Director of izmo Microsystems Pvt. Ltd., stated that this success validates their technical roadmap and ability to execute complex semiconductor packaging requirements, providing a viable solution for the 'NewSpace' industry where mass and volume reduction are critical. The global System-in-Package market is valued at over $20 billion, with the space electronics sector valued at over $10 billion. izmo Microsystems is now positioned within this evolving landscape for advanced semiconductor solutions.